Advanced wafer prober

Fully Automatic Mass Production Wafer Prober

MDSM-FA8
MDSM-FA12
Product description: wafer prober
INQUIRY

Product Introduction

MDSM-FA8 is a new high-power prober with a temperature range from room temperature to +200 °C and supports the measurement of high voltage 3 kV (Tri-axis)/10 kV (coaxi-al) and 500A. It can test high-power chip characteristics, which can also be tested on thin wafers or TAIKO wafers.

The innovative MDSM-FA8 prober has made new upgrades and improvements in technologies such as automatic wafer loading and unloading, micron-level full closed-loop motion control, automatic wafer contact, accurate visual calibration, high-speed feedback communication, and data information processing. The prober is equipped with a highly stable wafer testing technology.

Product Features

1.High precision and test speed, greatly improving test efficiency

2.Micron-level fully closed-loop motion control

3.High voltage and high current test application

4.Bernoulli arm supports thin wafer

5.Small size, light weight, and smaller footprint

6.24X7 hours on-chip detection

Product Parameters

Model		MDSM-FA8
Wafer	Wafer diameter	6inch，8inch
	Wafer thickness	50-2000μm
	Die Size	300-100000μm
	Weight	≤500g
Chuck	XY Travel range	260mm*450mm
	XY Repeatability	≤±1µm
	XY Accuracy	≤±2µm
	XY Resolution	0.1µm
	XY Maximum speed	200mm/s
	Z Travel range	0-80mm
	Z Repeatability	≤±1µm
	Z Accuracy	≤±2µm
	Z Resolution	0.1µm
	Z Maximum speed	80mm/s
Theta	Theta Rotation Range	±10°
Theta	Theta Resolution	0.00001°
Cassette / Wafer Size		4", 5", 6", 8"
Dimensions		11241158955mm
Voltage		50/60Hz AC220V
CDA air pressure		0.6-0.7MPA
Vacuum pressure		-70 to-90kpA

Product Introduction

MDSM-FA12 is a 12-inch (compatible with 8-inch) high-per-formance wafer test probe station that completes the WAT/CP test through precise contact between probe cards and wafer PAD points.

The device is easy-to-use and has superior mechanical stability, which can provide customers with low-cost and high-yield wafer test solutions and meet the test requirements of different customers such as wafer manufacturers, chip package plants, test factories.

Product Features

1.High precision and test speed, greatly

improving test efficiency

2.Micron-level fully closed-loop motion

control

3.24*7 hours on-chip detection

4.Friendly user interface

5.Automatic wafer loading and unloading

6.High strength low center of gravity design

Product Parameters

Model		MDSM-F12
Wafer	Wafer diameter	8inch，12inch
	Wafer thickness	200-2000μm
	Die Size	300-100000μm
	Weight	≤500g
Chuck	XY Travel range	X: ±170mm ; Y：-180，+600mm
	XY Repeatability	≤±1µm
	XY Accuracy	≤±2µm
	XY Resolution	0.1µm
	XY Maximum speed	240mm/s
	Z Travel range	0-80mm
	Z Repeatability	≤±1µm
	Z Accuracy	≤±2µm
	Z Resolution	0.1µm
	Z Maximum speed	80mm/s
Theta	Theta Rotation Range	±10°
Theta	Theta Resolution	0.00001°
Cassette / Wafer Size		6", 8", 12"
Dimensions		1595 x 1675 x 1500 mm
Voltage		50/60Hz AC220V
CDA air pressure		0.4-0.8MPA
Vacuum pressure		-70 to-90kpA