Advanced wafer prober

MP-M Series manual prober

Product Introduction

If your test PAD is larger than 30µm, the MP-M Series is one of your first choice in the lab.

Product Features

1.Upgrade able Modular design

2.Various modules can be selected according to test requirements

3.Closed mobile platform, dustproof, durable, and more accurate positioning

4.Po Mater adaptive isolation base

5.Adopting shock absorbtion materials imported from Germany to improve test stability

Product Parameters

Manual Prober Model		MP-M4/MP-M6/MP-M6mini	MP-E4/MP-E6/MP-E8/MP-E12	MP-H6/MP-H8/MP-H12
Chuck	Chuck material	Stainless Steel/Nickel or gold plated copper
	Chuck lift	N/A	Quick rise 5mm, fine tune 6mm
	Move quickly	N/A	N/A	√
Micropositioner platform lift		N/A	N/A	Quick lift 5mm,Fine adjustment 40mm,coarse adjustment 300μm
Microscope		Standard body microscope (optional video microscope mirror), can be magnified up to 100X	Standard PSM-1000 metallographic microscope / optional (GX-6 metallographic, stereo, video) microscope,it can be magnified to 2000X，and the microscope can be adjusted up and down by air control
Probe specification	Current leakage	Coaxial 1pA/V @ 25 °C; Three shaft 100fA/V @ 25 °C; Triaxial 10pA@3kv @25°C, Test conditions: dry environment for grounding shield (air dew point lower than -40°C)
	Connector type	Banana head/Alligator clip/Coaxial/Triaxial interface
Test application		DC/(IV, CV) testing Low current (class 100fA) testing 1/f noise test Device Characterization Test WLR, aging test RF test frequency up to 110GHz High power/high current/high voltage test
		/	Failure analysis test	Failure analysis test