Advanced wafer prober

Semi-Automatic Wafer Prober Station

MDSM-SAPX6/MDSM-SAPX8/MDSM-SAPX12
Product description: wafer prober
INQUIRY

Product Introduction

X series is a semi-automatic probe station that integrates electrical, light wave, microwave, and other testing functions.

IProfessionally respond to the performance test of advanced chips of various materials such as 6-inch/8-inch/12-inch Wafer (downward compatible) Si, GaN, SiC and so on.

It can perform 24X7 hours on-chip detection of wafers, MEMS, biological structures, optoelectron-ic devices, and other integrated circuits like LEDs, LCDs, and solar cells.

It can be equipped with temperature control systems to meet customers' requirements in high and low-temperature environments.

Product Features

1.Prober running speed can reach 70mm/s, which improves the test efficiency by more than 40%

2.-60 °C~300 °C wide test temperature range

3.Advanced multi magnification optical display system, high-precision measurement and dynamic monitoring provides more convenient probe contact

4.24*7 hours on-chip detection

5.Self developed software integration system with stronger compatibility

Product Parameters

Model		MDSM-SAPX6/MDSM-SAPX8/MDSM-SAPX12
Chuck	XY Travel range	350mm*365mm
	XY Resolution	0.1μm
	XY Repeatability	≤±1μm
	XY Move speed	≤70mm/s
	Z Travel range	20mm
	Z Resolution	0.1μm
	Z Repeatability	≤±1µm
	Z Move speed	≤20mm/s
Temperature specification	Range	- 60°C-300°C
	Stability	±0.1°C
	Resolution	0.01°C
Micropositioner specification	Current leakage	Coaxial 1pA/V @ 25 ℃; Three shaft 100fA/V @ 25℃; Triaxial 10pA@3kv @25°C，Test conditions: dry environment for grounding shield (air dew point lower than- 40°C)
Micropositioner specification	Connector type	Banana plug adapter/Coaxial /Three-axis/ SMA /SHV etc.
Multi-magnification optical system		15:1 three-speed zoom microscope, can display low, medium and high magnification images at the same time, easy to point needle
Wide application		Support SiC/GaN wafer test, high power wafer test Replaceable Chuck design for different wafer testing
Software funtion		1.Support semi-automatic control (available in manual test or upgrade to automatic test) 2.Automatic wafer alignment 3.Automatic die size measurement 4.Automatic wafer mapping and remote access of data 5.Managing and programming of input and output parameters freely 6.Fast multi-testers integration 7.One-button automatic RF calibration , automatic needle cleaning function 8.Operation system and applications are completely separated; operation system, application system and device test system can be upgraded independently 9.Can support single point test and continuous test 10.Automatically store data and curves, synchronously process data 11.Classifying test results by different bin values and display different color in wafer map 12.Speed limit control and safety interlock