Laser Cutting and Drilling machine

Fiber Laser Cutting Machine for Ceramics

MDSG-LC50
Product description: Laser Cutting Machine
INQUIRY

Equipment Features

1. This equipment is designed for positioning oxide ceramics and nitride ceramics, including aluminum oxide, aluminum nitride, zirconia, glass oxide, silicon nitride, silicon carbide, aluminum nitride, piezoelectric ceramic discs (Pb3O4, ZrO2, TiO2), sodium chloride ceramics (soft ceramics), magnesium chloride ceramics, boron oxide, boron nitride, and other ceramic materials. It is also suitable for various silicon wafer cutting and dicing processes.

2. Featuring an integrated structure, it operates pollution-free with a compact design, delivering excellent beam quality, stable output power, and extended service life. It enables flexible processing with high adaptability and low energy consumption.

3. Features a high-quality collimated cutting head for precise cutting results, integrated coaxial air-blowing system, and equipped with dust extraction.

4. High-precision motion system incorporates a linear motor motion platform mounted on a high-accuracy marble base, ensuring operational precision and stability.

5. Non-contact processing eliminates mechanical stress and prevents workpiece deformation.

6. Dedicated laser cutting software and CCD automatic positioning system effortlessly meet mass production demands and high-precision processing requirements. The powerful system software is compatible with multiple drawing programs including CDR and CAD, enabling editing and motion of any cutting patterns within a plane.

7. Non-contact processing eliminates mechanical stress and prevents workpiece deformation.

Technical Parameters

Model	MDSG-LC50
Laser wavelength	1064nm
Laser power	150W/300W/600W
Repetition rate	1~1000Hz continuously adjustable
Minimum Focused Spot Diameter	70μm
Cooling Method	Water cooling
Linear Motor Stage Travel	500mm×600mm
Z-axis travel	50mm
Z-axis Focusing Resolution	1μm
XY axis positioning accuracy	±5μm
Repeat Positioning Accuracy	±1μm
Maximum Idle Travel Speed of XY-axis	1000mm/s
CCD Automatic Positioning System	5 megapixels
Maximum Cutting Thickness	3mm (Ceramic Substrate)
Minimum Drilling Aperture	0.3mm (while ensuring roundness)
Equipment Dimension	1410 x2200 x 1810mm
Machine Weight	1800Kg
Power Supply	Alternating Current (AC) 380V, 50Hz, 8000VA