Laser Cutting and Drilling machine

Laser Scribing Machine for Glass

MDSG-LC52
MDSG-LC52S
Product description: Laser Cutting Machine
INQUIRY

Equipment Features

1. This equipment is designed for positioning mobile phone cover plates, optical glass, sapphire substrates, and electrical panel glass materials for large-hole drilling and precision cutting. It also handles large-hole, irregular-shaped hole processing, and contour cutting for home appliance glass.

2. Utilizing a high-performance laser with excellent beam quality, high peak power, narrow pulse width, and superior pulse stability;

3. The focused spot is small, resulting in narrow cuts, smooth edges, minimal chipping, high processing speed, and guaranteed quality and stability.

4. Equipped with high-precision scanning mirrors for fast speed and high accuracy.

5. Features industrial-grade control equipment with fully automated computer software control throughout the process, enabling long-term operation.

6. Non-contact laser processing causes no stress to the material, allowing for the processing of irregular and micro holes.

7. Configuration options: single/dual station available, processing format customizable.

Technical Parameters

Model	MDSG-LC52	MDSG-LC52S
Laser wavelength	1064nm
Laser power	60W (Optional: 30W/50W/80W)
Pulse length	<10PS
Cooling method	Water cooling
Table Travel	Single-station 0.65 x 0.95m	Dual-station 0.65 x 0.95m
X/Y Repeated Positioning Accuracy	≤±1µm
Z-axis travel	100mm
Z-axis positioning accuracy	±1μm
CCD camera	5 megapixels
Light Source	Adjustable-brightness annular light source
Positioning Mode	Automatic alignment with Mark recognition
Cutting speed	0-500mm/s Adjustable
Cutting Thickness	≤12mm
Minimum Cutting Chipping	<5μm
Machine Dimension	2100mm2080mm1960mm (excluding laminated lights)
Machine Weight	Approximately 3500KG
Operating Conditions (Water, Electricity, Gas)	Humidity: 10-70% (non-condensation principle); Clean environment; Power supply: AC220V±5%, L+N+E, <8KW; Ambient temperature: 18-28°C