Laser Cutting and Drilling machine

UV Laser Cutting Machine

MDSG-LC54
Product description: Laser Cutting Machine
INQUIRY

Equipment Features

1. This equipment is designed for cutting ultra-thin materials such as ceramic substrates, cover films, silicon wafers, and copper foils, including carbon fiber, graphene, polymer materials, and composites.

2. Utilizing a high-performance UV laser with a cold light source, the laser cutting process minimizes the heat-affected zone to as little as 10µm.

3. The processing is automatically controlled by computer software, with real-time feedback on the software interface for continuous monitoring of processing status.

4. High-precision linear motor work platform ensures high accuracy and fast speed.

5. High-precision scanning galvanometers deliver high accuracy and extended service life.

6. Optional CCD automatic positioning and automatic calibration are available.

Technical Parameters

Model	MDSG-LC54
Laser wavelength	355nm
Laser power	30W/45W
Repetition rate	400 kHz ~ 2 MHz
Pulse Energy	60 μJ @ 500 kHz
Focused Spot Size	< 15μm
Cooling Method	Water cooling
Linear Motor Stage Travel	500*500mm pulse energy
Z-axis travel	50mm
Z-axis Focusing Resolution	1μm
XY-axis positioning accuracy	±5μm
Repeat Positioning Accuracy	±1µm
CCD Automatic Positioning Accuracy	±3μm
Processing accuracy	±25μm
Processing Edge	<20µm (depending on the material)
Machine Dimension	1410 x2200 x 1810mm
Machine Weight	1800Kg
Power Supply	Alternating Current (AC) 380V, 50Hz, 8000VA