Application
ASHING
Polymer removal
DESCUM
Dry removal of hard mask layer
Photoresistance removal after female ion implantation
Removal of optical resistance between media
Photoresistance removal in BAW/SAW process
Dry cleaning of anti reflective graphic film layer Y
Silicon oxide or silicon nitride etching
Surface residue removal
Surface cleaning after etching
Silicon carbide etching
|
PLASMA source |
RF+BIAS |
|
|
power |
ICP |
1000W |
|
BIAS |
600W |
|
|
Size |
4~8inch |
|
|
Process quantity per one time |
1 |
|
|
size |
1140mmx1050mmx1620mm |
|
|
Control system |
Industrial control |
|
|
Mode |
Manual |
|
联系人：胡顺语
手机：0086-15813334038
电话：020-84789496
邮箱：md@minder-hightech.com
地址： 广州市番禺区大龙街市新路新水坑段43号813
