PR removal RTP USC

  • Fully automatic dual chamber Rapid Thermal Processing system
Fully automatic dual chamber Rapid Thermal Processing system

Fully automatic dual chamber Rapid Thermal Processing system


Feature

l  Compatible with 6-8inch WAFER

l  The maximum temperature can reach 1250°c

l  Stable temperature reproducibility

l  Fully automatic dual chamber design to increase production capacity

l  Uniformity of ultra-high temperature field

l  Meet the demand for SlC mass production process

ltems

Indicators

Maximum product size

6-8 inches

CASSETTE OR SMIF

Two

Temperature range

room temperature~1250℃

Maximum heating rate

≤30℃/s(carrier)

temperature uniformity

±3℃≤600℃    ±0.5%>600℃

Temperature repeatability

±1℃

Number of cavities

Dual chamber

上一个:MDDB-LA838 Die attach 下一个:Semi-automatic RTP

导航栏目

联系我们

CONTACT US

联系人:胡顺语

手机:0086-15813334038

电话:020-84789496

邮箱:md@minder-hightech.com

地址: 广州市番禺区大龙街市新路新水坑段43号813