MDDB-LA838 Die attach

Using Windows 7 operating system

21.5 inch LCD display

4. Visual system:

Accurate image recognition and positioning system

Z-direction travel of ejector:

4mm

Bonding pressure:

Surface absorption 20g-200g(optional 500g)

Bonding X/Y/Z:

Linear motor reciprocating

Bonding angle:

Multi-angle solidification

Dispensing system:

Independent double point adhesive system

Wafer platform:

Equipped with automatic wafer expanding system and mapping function

Track:

Adjust the width according to the actual size of the frame, and the bottom plate has vacuum adsorption, and the upper surface has a downward pressure type fixture

Loading and unloading system:

There are two options for feeding: suction feeding and box feeding; Blanking and receiving with material box

Motor control:

High precision AC servo drive motor, linear motor system

Crop specification

Work cycle:

14K/H(The actual production capacity is determined according to the leadframe)

XY positioning accuracy:

±1mil

Die deflection angle:

±3°

Production Product Specifications

Leadframe:

Width 35MM~100mm

Die size:

5mil*5mil～120mil*120mil

Wafer Ring Size:

ø14″（OD400mm ID350mm)

Electrical specifications

Power Supply:

220V±10V，50HZ,1.3KW

Air source ( positive pressure):

0.4～0.6Mpa

Air source (negative pressure):

-85～-100Kpa

Appearance specification

Volume (L * W * H):

1350mm*1400mm*1750mm

Weight:

1100Kg

work environment

ambient humidity:

40%-70%

Ambient temperature:

22℃-26℃

Space:

It is recommended to reserve 50-100cm for the weekly maintenance of the equipment to facilitate maintenance