IC/TO Package line

Automatic die sorter

MDAX-DS360 MD-AX380 Die Sorter Technical specification
Worktable (Linear Module)	Optics System
Worktable stroke:150x250mm(2" tray *8 pcs;can customize)	Camera
Resolution:1μm	Optics Magnifier (wafer) :0.7 times to 4.5 times optional bigger one
Wafer Table (Linear Module)	Cycle Time 200MS/EA
XY stroke:8"8"(MDAX-DS360);12"12"（MDAX-DS380)	Die bonding cycle is less than 250 milliseconds, production capacity is greater than 12k;
Resolution: 1μm
Rotary wafer table:optional	Loading and unloading module
	Manual upload and download
Wafer placement accuracy	optional magazine upload and dowload
Adhesive die position:±25um
Rotation accuracy:±3°

Dispensing module	Equipment Require
optional stamp method for bonding usage	Voltage: AC220V/50HZ
	Air Source:minimum6BAR
	Vacuum Source:700mmHG（Vacuum pump）
	Power Consumpion ：3000w
PR System	Dimensions And Weight
Method:256 grey levels	Weight :1000kg
Detection : ink/chipping/cracked die	Size(DxWxH)外型尺寸 130014001700mm
Monitor :17"LCD	Missing Die :yes
Monitor Resolution:1024*768	Vacuum Sensor