Application:
Silicon carbide etching
Surface cleaning after etching
DESCUM
Hard mask layer, dry removal
Silicon oxide or silicon nitride etching
Removal of optical resistance between media
Surface residue removal
PLASMA source |
RF |
|
Power |
ICP |
_ |
BIAS |
1000W(option) |
|
Applicable scope |
4~8 inch |
|
Single processing slice count |
1 |
|
Appearance dimensions |
850mmx900mmx1850mm |
|
System control |
PLC |
|
Automation level |
Manual |
联系人:胡顺语
手机:0086-15813334038
电话:020-84789496
邮箱:md@minder-hightech.com
地址: 广州市番禺区大龙街市新路新水坑段43号813