PR removal RTP USC

ICP PLASMA Photoresist Remover

Application:

ASHING

Polymer removal

Dry removal of hard mask layer

Photoresistance removal after ion implantation

Photoresistance removal in BAW/SAW process

Dry cleaning of anti reflective graphic film layer

Surface residue removal

Surface cleaning after etching

DESCUM

PLASMA SOURCE		RF	RF
Power	ICP	1000w	1000w
Power	BIAS	600w(option)	600w(option)
Applicable scope		4~8inch	4~8inch
Single processing slice count		1	2
Appearance dimensions		1080x1840x1800mm	1340x2050x1800mm
System control		Industrial control system	Industrial control system
Automation level		automatic	automatic