Application:
DESCUM
Wafer cleaning
Removing residual glue after wet process
Surface residue removal
Remove residual glue after exposure and development
|
Model |
PR-C1000 |
PR-C1000-MW |
|
PLASMA source |
RF |
microwave |
|
Power |
1000w |
1250w |
|
Applicable scope |
4~8 inch |
4~8inch |
|
Single processing slice count |
4~6 inch=50 piece /8inch=25 piece |
4~6 inch=50 piece/8 inch=25 piece |
|
Appearance dimensions |
1250x1630x1900mm |
1250x1630x1900mm |
|
System control |
PC |
PC |
|
Automation level |
Auto |
Auto |
联系人：胡顺语
手机：0086-15813334038
电话：020-84789496
邮箱：md@minder-hightech.com
地址： 广州市番禺区大龙街市新路新水坑段43号813
