Application:
DESCUM
Wafer cleaning
Removing residual Photoresist after wet process
Surface residue removal
Remove residual Photoresist after exposure and development
|
PLASMA source |
RF |
microwave |
|
Power |
1000w |
1250w |
|
Applicable scope |
4~8寸 |
4~8寸 |
|
Single processing slice count |
4-6 inch =50 pieces/8 inches=25 pieces |
4-6 inch =50 pieces/8 inches=25 pieces |
|
Appearance dimensions |
1000x850x1700mm |
1000x850x1700mm |
|
System control |
PC |
PC |
|
Automation level |
Manual |
Manual |
联系人：胡顺语
手机：0086-15813334038
电话：020-84789496
邮箱：md@minder-hightech.com
地址： 广州市番禺区大龙街市新路新水坑段43号813
