Application:
DESCUM
Wafer cleaning
Removing residual glue after wet process
Surface residue removal
Remove residual glue after exposure and development
PLASMA Source |
RF |
Power |
1000W |
Size |
4~12inch |
Quantity per one time |
4inch=16pcs/6inch=9pcs/8inch=5pcs/12寸=3pcs |
size |
1200mmx1100mmx1600mm |
Control system |
PLC |
Mode |
Manual |
联系人:胡顺语
手机:0086-15813334038
电话:020-84789496
邮箱:md@minder-hightech.com
地址: 广州市番禺区大龙街市新路新水坑段43号813