Laser Trimming Machine

Laser trimming machine for Wafer

MDSG-LT74
Product description: Laser trimming machine
INQUIRY

Equipment Features

1. This equipment is designed for laser trimming of high-end semiconductor wafers.

2. Equipped with a laser imported from the United States, it delivers exceptional stability during laser trimming.

3. Features an anti-interference, high-precision linear motor XY stage with a grating scale, effectively mitigating machine-induced interference on products.

4. Incorporates a 12-megapixel CCD camera for precise positioning.

5. Features achromatic imaging technology and image recognition positioning capabilities.

6. Features GPIB and other external interfaces for connecting external instruments for measurement or resistance adjustment

7. Marble base ensures excellent machine stability

Technical Parameters

Model	MDSG-LT74
Laser wavelength	1064/355nm
Laser power	6W/4W
Typical Spot Size	25-35μm
Focusing Method	Automatic, computer program controlled.
Cooling Method	Air cooling
Laser Beam Movement Range	27mm X 27mm
Movement resolution	0.76μm
Repeat Positioning Accuracy	±2.5µm
Movement Mode	Anti-interference grating ruler linear motor
Motion Range	300mmx300mm
Repeat Positioning Accuracy	±1µm
Resistance Measurement Method	4-wire measurement
Resistance Measurement Accuracy	±0.02% (medium resistance)
Resistance Measurement Range	0.1Ω-50MΩ
Measurement Speed	4µs/measurement
Zero and Full-Scale Error Correction	Automatic correction
Probe Definition	Programmable arbitrary setting
Interface	GPIB
Equipment Dimension	1430 x 913 x 1747mm
Weight	617Kg
Operating Conditions (Water, Electricity, Gas)	Humidity: <70%; Power supply: AC 220V 2.5kW; Compressed air: <0.6MPa, <40L/min