Application:
DESCUM
Wafer cleaning
Removing residual Photoresist after wet process
Surface residue removal
Remove residual Photoresist after exposure and development
PLASMA source |
RF |
microwave |
Power |
1000w |
1250w |
Applicable scope |
4~8寸 |
4~8寸 |
Single processing slice count |
4-6 inch =50 pieces/8 inches=25 pieces |
4-6 inch =50 pieces/8 inches=25 pieces |
Appearance dimensions |
1000x850x1700mm |
1000x850x1700mm |
System control |
PC |
PC |
Automation level |
Manual |
Manual |
Contact: Minder Hu
Phone: 0086-15813334038
Tel: 020-84789496
Email: md@minder-hightech.com
Add: 813,No.43,Xinshuikeng Section, Shixin Road, Dalong street,Panyu District,Guangzhou. Zip:511442