Application:
DESCUM
Wafer cleaning
Removing residual glue after wet process
Surface residue removal
Remove residual glue after exposure and development
|
Model |
PR-C1000 |
PR-C1000-MW |
|
PLASMA source |
RF |
microwave |
|
Power |
1000w |
1250w |
|
Applicable scope |
4~8 inch |
4~8inch |
|
Single processing slice count |
4~6 inch=50 piece /8inch=25 piece |
4~6 inch=50 piece/8 inch=25 piece |
|
Appearance dimensions |
1250x1630x1900mm |
1250x1630x1900mm |
|
System control |
PC |
PC |
|
Automation level |
Auto |
Auto |
Contact: Minder Hu
Phone: 0086-15813334038
Tel: 020-84789496
Email: md@minder-hightech.com
Add: 813,No.43,Xinshuikeng Section, Shixin Road, Dalong street,Panyu District,Guangzhou. Zip:511442
