Application:
DESCUM
Wafer cleaning
Removing residual glue after wet process
Surface residue removal
Remove residual glue after exposure and development
|
PLASMA Source |
RF |
|
Power |
1000W |
|
Size |
4~12inch |
|
Quantity per one time |
4inch=16pcs/6inch=9pcs/8inch=5pcs/12寸=3pcs |
|
size |
1200mmx1100mmx1600mm |
|
Control system |
PLC |
|
Mode |
Manual |
Contact: Minder Hu
Phone: 0086-15813334038
Tel: 020-84789496
Email: md@minder-hightech.com
Add: 813,No.43,Xinshuikeng Section, Shixin Road, Dalong street,Panyu District,Guangzhou. Zip:511442
