1. Semi-automatic wafer bonding machine, which can effectively perform wafer bonding operations.
Features
1. The whole process of wafer bonding is controlled by touch screen. The semi-automatic wafer bonding machine controlled by touch screen program can set the time of each stage and effectively perform wafer bonding operation.
2. It can be customized according to the size of customer samples.
3. It can be controlled and operated by single workstation or multiple workstations.
4. The operating temperature of the heating table can reach up to 300 degrees.
5. The top airbag is pressurized and the vacuum pump is vacuumed and degassed.
6. The maximum bonding wafer is 6 inches.
7. It can be bonded under vacuum.
8. Automatic water cooling system with metal coils.
9. The airbag pressure is adjustable from 0 to 3 Bar.
10. The maximum heating temperature is 200 degrees.
联系人：胡顺语
手机：0086-15813334038
电话：020-84789496
邮箱：md@minder-hightech.com
地址： 广州市番禺区大龙街市新路新水坑段43号813
