Semiconductor laboratory machines

  • Cylinder polishing machine
Cylinder polishing machine

Cylinder polishing machine

Features

1. Maximum cylinder diameter for curved surface polishing is 100mm

2. Maximum inner hole diameter for curved surface polishing is 20mm

3. Dual peristaltic pump feeding

4. Disc speed is adjustable from 5 to 100rpm

5. Drip rate is evenly adjustable from 1 to 100ml/min

6. Full LCD screen control

导航栏目

联系我们

CONTACT US

联系人:胡顺语

手机:0086-15813334038

电话:020-84789496

邮箱:md@minder-hightech.com

地址: 广州市番禺区大龙街市新路新水坑段43号813