Semiconductor laboratory machines

  • Manual Wafer Scriber
Manual Wafer Scriber

Manual Wafer Scriber

1.Equipment for scribing and splitting semiconductor substrates such as GaAs and Inp.

2.Can be used for R&D and mass production.

Features

1. The maximum wafer size that can be scratched is 8 inches.

2. The scratch width is ≤ 10μm.

3. The resolution is 1μm.

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