□Maximal Diameter of Cutting Ingot: ￠153mm
□Blade Standard:￠690mm×￠241mm×0.15mm or ￠690mm× ￠235mm×0.15mm
□Maximal Length of Cutting Ingot:350mm
□Cutting speed:0.2〜～99mm/min
□Return Speed:1〜～1000mm/min
□The speed of main spindle:1420r/min
□Stepping deviation of feeding :±0.005mm(testing with l mm feeding step)
□Range of Wafer Thickness:0.001〜～68.00mm
□Adjustment only of Crystal Direction:0.001mm
□Adjustment of Crystal Direction:
Horizontal range（x）±7°（resolution：2＇）
Vertical range（Y）±7º（resolution：2＇）
□ Power：3.5kw,〜380v±38v, 50HZ±1HZ
□Source of Air：0.4〜0.5MPa,250L/min(instantaneous flux when braking)
□Sour of cooling water:0.2〜～0.4mpa;5L/min
□Touching Panel： 7.7inch
□Dimension:1610mm×1100mm×2070mm
□Weight:2800kg
□English interface
联系人：胡顺语
手机：0086-15813334038
电话：020-84789496
邮箱：md@minder-hightech.com
地址： 广州市番禺区大龙街市新路新水坑段43号813
