1. Small desktop single workstation model, used for high-precision grinding and polishing of wafers and samples.
2. The grinding and polishing disc has a diameter of 400mm and can be used for processing wafers and samples of six inches or less.
Features
1. Maximum wafer size for grinding and polishing is 6 inches.
2. Swing arm swing amplitude is adjustable from 0 to 15 degrees.
3. Swing arm swing speed is uniformly adjustable.
4. Drip rate is uniformly adjustable from 1 to 100 ml/min.
5. Full LCD screen control.
6. Plate speed is 5-100 rpm.
联系人：胡顺语
手机：0086-15813334038
电话：020-84789496
邮箱：md@minder-hightech.com
地址： 广州市番禺区大龙街市新路新水坑段43号813
