Main purpose of the equipment:
Mainly used for thinning and grinding of hard and brittle materials such as sapphires, semiconductors,ceramics, quartz crvstals, and circuit poard packaging
) The equipment adopts a vertical machining structure, which conforms to the in feed grinding principle
2) The product tray is customized according to customer product requirements.
3) The feed axis of the grinding wheel adopts a fully closed-loop control system.
4) Termination of thickness measurement system and rea -time thickness measurement system (optiona5)Network transmission sytem (optional)
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Equipment specifications |
MD-SG250 |
MD-SG300 |
MD-SG350 |
|
Carrier specifications |
φ250mm |
φ300mm |
φ350mm |
|
Processing thickness |
≤50mm |
≤50mm |
≤50mm |
|
Equipment power supply |
380V |
380V |
380V |
|
Equipment size |
850x1400x2000mm |
850x1400x2000mm |
850x1400x2000mm |
|
Equipment weight |
1800 KG |
1800 KG |
2000 KG |
Technical Services
There are maintenance stations (points) in China, all necessary spare parts are stored, and a supply period of more than 10 years is guaranteed
More than 5 years of domestic technical service experience on similar equipment
After-sale warranty
1 year warranty, after the warranty period, we will continue to provide equipment maintenance service once a year for no less than two years
Respond within 12 hours, arrive at the scene within 72 hours
联系人：胡顺语
手机：0086-15813334038
电话：020-84789496
邮箱：md@minder-hightech.com
地址： 广州市番禺区大龙街市新路新水坑段43号813
