Grinding and polishing machine

Air spindle full automatic wafer grinder

□ Fully automatic wafer back thinning

□ Grindable wafer size4 “/5”/6”/8”

□ Two axis three disc mode

□ Online thickness measurement

□ Wafer cleaning and drying

□ Dry in,dry out

Grindable wafer	Size	Inches	4,5,6,8
Wafer cassette	Number	-	2
Rubbing way		-	Vertical plunge grinding method
Grinding wheel spindle	Types	-	Air bearings
	Quantity	-	2
	Speed	rpm	0~5000
	Output Power	Kw	5.5/7.5
	Stroke	mm	150
	Feed Speed	um/s	0.01~100
	Fast forward speed	mm/min	300
	Resolution	um	0.1
Workpiece axis	Type	-	Ball bearings
	Quantity	-	3
	Suction cup type	-	Microporous ceramics
	Wafer suction method	-	Vacuum adsorption
	Speed	rpm	0~300
Wafer transfer		-	Robot arm
		-	Revolving disk
Other functions	Wafer centering	-	Mobile pin alignment
	Wafer cleaning	-	Water and air cleaning,spin drying
	Suction cup cleaning	-	Oilstone cleaning
Grinding wheel		mm	Φ200
Online measurement	Measurement range	um	0~1800
	Resolution	um	0.1
	Repeat accuracy	um	±0.5
Machining accuracy	Intra-wafer accuracy (TTV)	um	≤2
	Inter-wafer accuracy (WTW)	um	±3
	Surface roughness (Ry)	um	0.13(2000#finish)
Appearance	Appearance coloring	um	Orange Pattern
	Dimensions(W×D×H)	mm	1200×2750×1950
	Weight	kg	4200