Grinding and polishing machine

Double side lapping polishing machine

MDHD-9B
产品描述：Double side lapping polishing machine
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1. Equipment use range

This equipment is mainly used for simultaneous grinding and polishing of the upper and lower parallel end surfaces of thin precision parts made of non-metallic and metal hard and brittle materials such as silicon wafers, ceramic wafers, optical glass, quartz crystals, and other semiconductor materials.

2. Main technical parameters

NO.	Item	Specifications
1	Grinding disc size	Φ640mm×Φ235mm×30mm
2	Maximum grinding workpiece diameter	Φ210mm
3	Planetary wheel parameters	English DP12, Z=108 Metric M=2, Z=114
4	Minimum workpiece thickness	0.40mm
5	Number of planetary wheels per disc	5
6	Number of grinding workpieces per disc	(1)Φ50mm, 40 pieces (2)Φ75mm, 25 pieces (3)Φ100mm, 10 pieces
7	Grinding disc speed	0~56rpm
8	Power supply	AC380V, 50Hz
9	Air source	0.5~0.6Mpa
10	Dimensions	1650mm×1150mm×2530mm