Grinding and polishing machine

Air spindle semi automatic wafer grinder

□ Semi automatic single axis wafer back thinning

□ Grindable wafer size 4-8 "

□ Single axis single disc mode

□ Online thickness measurement

□ Corresponding to irregular specifications

Grindable wafer	Size	Inches	4,5,6,8
Rubbing way		-	Vertical plunge grinding method
Grinding wheel spindle	Types	-	Air bearings
	Quantity	-	1
	Speed	rpm	0~5000
	Output Power	Kw	5.5/7.5
	Stroke	mm	150
	Feed Speed	um/s	0.01~100
	Fast forward speed	mm/min	300
	Resolution	um	0.1
Workpiece axis	Type	-	Ball bearings
	Quantity	-	1
	Speed	rpm	0~300
	Power	kw	0.75
	Suction cup type	-	Microporous ceramics
	Wafer suction method	-	Vacuum adsorption
Wafer transfer		-	Manual
Other functions	Wafer centering	-	-
	Wafer cleaning	-	-
	Suction cup cleaning	-	-
Grinding wheel		mm	Φ200
Online measurement	Measurement range	um	0~1800
	Resolution	um	0.1
	Repeat accuracy	um	±0.5
Machining accuracy	Intra-wafer accuracy (TTV)	um	≤2
	Inter-wafer accuracy (WTW)	um	±3
	Surface roughness (Ry)	um	0.1(2000#finish)
Appearance	Appearance coloring	um	Orange Pattern
	Dimensions(W×D×H)	mm	690×1720×1780
	Weight	kg	1400

MDXZ-G300HG

□ Semi automatic single axis wafer back thinning

□ Grindable wafer size 6、8、12”

□ Single axis single disc mode

□ Online thickness measurement

□ Corresponding to irregular specifications

Grindable wafer	Size	Inches	6,8,12
Rubbing way		-	Vertical plunge grinding method
Grinding wheel spindle	Types	-	Air bearings
	Quantity	-	1
	Speed	rpm	0~5000
	Output Power	Kw	5.5/7.5
	Stroke	mm	150
	Feed Speed	um/s	0.01~100
	Fast forward speed	mm/min	300
	Resolution	um	0.1
Workpiece axis	Type	-	Ball bearings
	Quantity	-	1
	Speed	rpm	0~300
	Suction cup type	-	Microporous ceramics
	Wafer suction method	-	Vacuum adsorption
Wafer transfer		-	Manual
Other functions	Wafer centering	-	-
	Wafer cleaning	-	-
	Suction cup cleaning	-	-
Grinding wheel		mm	Φ300
Online measurement	Measurement range	um	0~1800
	Resolution	um	0.1
	Repeat accuracy	um	±0.5
Machining accuracy	Intra-wafer accuracy (TTV)	um	≤3
	Inter-wafer accuracy (WTW)	um	±3
	Surface roughness (Ry)	um	0.13(2000#finish)
Appearance	Appearance coloring	um	Orange Pattern
	Dimensions(W×D×H)	mm	790×2170×1830
	Weight	kg	1800