1.Equipment for scribing and splitting semiconductor substrates such as GaAs and Inp.
2.Can be used for R&D and mass production.
Features
1. The maximum wafer size that can be scratched is 8 inches.
2. The scratch width is ≤ 10μm.
3. The resolution is 1μm.
Contact: Minder Hu
Phone: 0086-15813334038
Tel: 020-84789496
Email: md@minder-hightech.com
Add: 813,No.43,Xinshuikeng Section, Shixin Road, Dalong street,Panyu District,Guangzhou. Zip:511442
