□Maximal Diameter of Cutting Ingot: ￠153mm
□Blade Standard:￠690mm×￠241mm×0.15mm or ￠690mm× ￠235mm×0.15mm
□Maximal Length of Cutting Ingot:350mm
□Cutting speed:0.2〜～99mm/min
□Return Speed:1〜～1000mm/min
□The speed of main spindle:1420r/min
□Stepping deviation of feeding :±0.005mm(testing with l mm feeding step)
□Range of Wafer Thickness:0.001〜～68.00mm
□Adjustment only of Crystal Direction:0.001mm
□Adjustment of Crystal Direction:
Horizontal range（x）±7°（resolution：2＇）
Vertical range（Y）±7º（resolution：2＇）
□ Power：3.5kw,〜380v±38v, 50HZ±1HZ
□Source of Air：0.4〜0.5MPa,250L/min(instantaneous flux when braking)
□Sour of cooling water:0.2〜～0.4mpa;5L/min
□Touching Panel： 7.7inch
□Dimension:1610mm×1100mm×2070mm
□Weight:2800kg
□English interface
Contact: Minder Hu
Phone: 0086-15813334038
Tel: 020-84789496
Email: md@minder-hightech.com
Add: 813,No.43,Xinshuikeng Section, Shixin Road, Dalong street,Panyu District,Guangzhou. Zip:511442
