Semiconductor laboratory machines

  • Cylinder polishing machine
Cylinder polishing machine

Cylinder polishing machine

  • Product description: Cylinder polishing machine
  • INQUIRY

Features

1. Maximum cylinder diameter for curved surface polishing is 100mm

2. Maximum inner hole diameter for curved surface polishing is 20mm

3. Dual peristaltic pump feeding

4. Disc speed is adjustable from 5 to 100rpm

5. Drip rate is evenly adjustable from 1 to 100ml/min

6. Full LCD screen control

CATEGORIES

CONTACT US

Contact: Minder Hu

Phone: 0086-15813334038

Tel: 020-84789496

Email: md@minder-hightech.com

Add: 813,No.43,Xinshuikeng Section, Shixin Road, Dalong street,Panyu District,Guangzhou. Zip:511442