Semiconductor laboratory machines

Automatic scribing cleaving dicing machine

MCJL-SB06
Product description: Automatic scribing cleaving dicing machine
INQUIRY

Product Introduction

It is a special equipment suitable for dicing and cleaving GaN, GaAs, InP and other compound semiconductor wafer materials below 4 inches. It is widely used in the cleavage and segmentation of laser devices, photoelectric detectors, and microwave devices.

Product Performance

Slicing head	X-axis	Travel range：160mm	Roller pressure	0~ 100gf
		Positioning accuracy：3um	Scraper pressure	0~20gf
	Y-axis	Travel range：160mm	Equipment weight	About 150kg
		Positioning accuracy：3um	Lens Y direction	Travel range：160mm
θ-axis		120 degree rotation	Dimensions	1170mm×730mm×500mm
Wafer size		Applicable to 6-inch ( 150mm) wafers	Operation interface	19.5" TFT color screen, Chinese interface
Image system		2 .0X magnification (4X other magnifications are optional)	Control system	Windows7 operating system, dedicated control software for cleavage machine
Standard configuration		Host\Computer\19.5” monitor\ESD dissection machine control software\Mouse and keyboard
Optional accessories		8-inch iron ring\θ-direction automatic straightening software algorithm\Various blue films\Double-sided tape