Semiconductor laboratory machines

Automatic Cleaving machine

Product description: Automatic Cleaving machine
INQUIRY

Product Introduction

It is a special equipment suitable for dicing and cleaving compound semiconductor wafer materials such as GaN, GaAs, InP, etc. below 4 inches. It is widely used in the cleavage and segmentation of laser devices, photoelectric detectors, and microwave devices.

Product Performance

Slicing head	X-axis	Travel range：120mm	Roller pressure	0~100gf
		Positioning accuracy：5um	Scraping knife pressure	0~20gf
	Y-axis	Travel range：100mm	Equipment weight	About 60kg
θ-axis		+/-5 degree rotation	Lens Y direction
Lens Y direction		Travel range: 100mm	Dimensions	650 mm ×650 mm ×400mm
Wafer size		Applicable to wafers within 4 inches (100mm)	Operation interface	19.5" TFT color screen, Chinese interface
Image system		6X magnification (4X other magnifications are optional)	Control system	Windows 7 or Windows 10 operating system, dedicated control software for the cleavage machine
Standard configuration		Host\brand computer\19.5” monitor\ESD dissection machine control software\mouse and keyboard
Optional accessories		Square support\support film tooling\θ-direction automatic straightening software algorithm\various blue films\double-sided tape