Semiconductor laboratory machines

Wafer grinding machine

MD-SG250
MD-SG300
MD-SG350
Product description: Wafer grinding machine
INQUIRY

Main purpose of the equipment:

Mainly used for thinning and grinding of hard and brittle materials such as sapphires, semiconductors,ceramics, quartz crvstals, and circuit poard packaging resins

Features

1) The equipment adopts a vertical machining structure, which conforms to the in feed grinding principle

2) The product tray is customized according to customer product requirements.

3) The feed axis of the grinding wheel adopts a fully closed-loop control system.

4) Termination of thickness measurement system and rea -time thickness measurement system (optiona5)Network transmission sytem (optional)

Parametric Metrics

Equipment specifications	MD-SG250	MD-SG300	MD-SG350
Carrier specifications	φ250mm	φ300mm	φ350mm
Processing thickness	≤50mm	≤50mm	≤50mm
Equipment power supply	380V	380V	380V
Equipment size	850x1400x2000mm	850x1400x2000mm	850x1400x2000mm
Equipment weight	1800 KG	1800 KG	2000 KG