Grinding and polishing machine

Double side lapping and polishing machine

MDHD-13B
Product description: Double side lapping and polishing machine
INQUIRY

1. Equipment Introduction

1. This machine is mainly used for high-precision double-sided grinding or polishing of silicon wafers, gallium arsenide wafers, ceramic wafers, quartz crystals and other semiconductor materials. It is also suitable for high-precision double-sided grinding or polishing of other hard, brittle and thin materials such as metals, non-metals, optical glass, sapphire, etc.

2. The grinding disc is cast with QT600-3 and milled into 25x25 (mm) squares with a groove width of 2mm.

3. The liquid collecting tank is made of 304 stainless steel and is equipped with a liquid circulation filtration and stirring system.

4. The machine is equipped with a self-lubricating system.

2. Equipment Features

1. The machine body structure is optimized and the frame adopts a gantry structure with good rigidity and strong pressure bearing capacity, which can meet the requirements of high-speed and stable operation under high load.

2. The lower plate, upper plate and sun gear are driven by motors separately. The motors are all variable frequency motors and controlled by variable frequency speed regulators. They can work at any speed within the effective setting range, realize smooth stopping, acceleration, deceleration and reversing, and effectively prevent the thin and brittle workpieces from breaking.

3. The planetary gear transmission adopts a pin-tooth structure, which has smooth transmission and no impact, and the planetary gear has a long service life. The pin-tooth is made of stainless steel material and hardened by heat treatment, which is rust-proof and wear-resistant. After the pin-tooth is worn, only the pin sleeve needs to be replaced, which is convenient and simple, and the use cost is low.

4. During the descent of the upper plate, fast descent and slow descent are set. The slow descent stroke is adjustable within the cylinder stroke range, and the slow descent speed can also be freely adjusted according to the impact resistance of the workpiece.

5. This machine adjusts and controls the processing pressure through a precision electrical proportional valve. The processing pressure can be set according to different processing requirements, and the pressure control accuracy is high.

6. It adopts an advanced PLC system and a touch screen operation panel. All process parameters and process formulas can be modified and set on the touch screen. The entire processing process can be automatically completed according to the set process parameters.

7. The gears and various moving parts use a centralized lubrication device, which is well lubricated and has a long service life.

8. The upper plate lifting design has a safety device, which can effectively protect the upper plate from falling suddenly when it rises to the top.

3. Main technical parameters

NO.	Item	Specifications
1	Upper grinding disc size	Ø970×Ø400×45(mm)
2	Lower grinding disc size	Ø970×Ø400×45(mm)
4	Planar gear parameters	Pin tooth diameter ￠10 Pitch 15.7 Number of teeth 64
5	Number of pinion gears	5
6	Outer gear ring lifting stroke	30mm
7	Maximum workpiece size	290 (mm) (rectangular diagonal)
8	Workpiece thickness	0.4-20(mm)
9	Lower grinding disc speed	0-50(rmp)
10	Lower disc flatness (after grinding)	≤0.03mm
11	Speed control accuracy	≤0.02mm
12	Processing pressure	≤0.5rpm
13	Pressure control accuracy	10-350Kg
14	Main cylinder	≤±2kg
15	Main motor	125×450
16	Upper plate motor	YVP132L-7.5KW
17	Auxiliary motor	YVP132M-5.5KW
18	Sand pump power	YVP90L-2.2KW
19	Total equipment power (approximately)	18KW
20	Dimensions	1800×1500×2550(mm)
21	Equipment quality	≈3200Kg

4. Installation conditions

NO.	Item	Index requirements
1	Environment	The ground inside is flat and has no vibration source
2	Water source	Pure water or tap water
3	Power supply	Three-phase five-wire 380V
4	Compressed air source	0.6～0.8Mpa
5	Temperature	0℃-45℃
6	Relative humidity	≤95%