Air spindle semi automatic wafer grinder

Grindable wafer

Size

Inches

4,5,6,8

Rubbing way

-

Vertical plunge grinding method

Grinding wheel spindle

Types

-

Air bearings

Quantity

-

1

Speed

rpm

0~5000

Output Power

Kw

5.5/7.5

Stroke

mm

150

Feed Speed

um/s

0.01~100

Fast forward speed

mm/min

300

Resolution

um

0.1

Workpiece axis

Type

-

Ball bearings

Quantity

-

1

Speed

rpm

0~300

Power

kw

0.75

Suction cup type

-

Microporous ceramics

Wafer suction method

-

Vacuum adsorption

Wafer transfer

-

Manual

Other functions

Wafer centering

-

-

Wafer cleaning

-

-

Suction cup cleaning

-

-

Grinding wheel

mm

Φ200

Online

measurement

Measurement range

um

0~1800

Resolution

um

0.1

Repeat accuracy

um

±0.5

Machining

accuracy

Intra-wafer accuracy (TTV)

um

≤2

Inter-wafer accuracy (WTW)

um

±3

Surface roughness (Ry)

um

0.1(2000#finish)

Appearance

Appearance coloring

um

Orange Pattern

Dimensions(W×D×H)

mm

690×1720×1780

Weight

kg

1400

Grindable wafer

Size

Inches

6,8,12

Rubbing way

-

Vertical plunge grinding method

Grinding wheel spindle

Types

-

Air bearings

Quantity

-

1

Speed

rpm

0~5000

Output Power

Kw

5.5/7.5

Stroke

mm

150

Feed Speed

um/s

0.01~100

Fast forward speed

mm/min

300

Resolution

um

0.1

Workpiece axis

Type

-

Ball bearings

Quantity

-

1

Speed

rpm

0~300

Suction cup type

-

Microporous ceramics

Wafer suction method

-

Vacuum adsorption

Wafer transfer

-

Manual

Other functions

Wafer centering

-

-

Wafer cleaning

-

-

Suction cup cleaning

-

-

Grinding wheel

mm

Φ300

Online

measurement

Measurement range

um

0~1800

Resolution

um

0.1

Repeat accuracy

um

±0.5

Machining

accuracy

Intra-wafer accuracy (TTV)

um

≤3

Inter-wafer accuracy (WTW)

um

±3

Surface roughness (Ry)

um

0.13(2000#finish)

Appearance

Appearance coloring

um

Orange Pattern

Dimensions(W×D×H)

mm

790×2170×1830

Weight

kg

1800