Grinding and polishing machine

Double side lapping polishing machine

MDHD-9B
Product description: Double side lapping polishing machine
INQUIRY

1. Equipment use range

This equipment is mainly used for simultaneous grinding and polishing of the upper and lower parallel end surfaces of thin precision parts made of non-metallic and metal hard and brittle materials such as silicon wafers, ceramic wafers, optical glass, quartz crystals, and other semiconductor materials.

2. Main technical parameters

NO.	Item	Specifications
1	Grinding disc size	Φ640mm×Φ235mm×30mm
2	Maximum grinding workpiece diameter	Φ210mm
3	Planetary wheel parameters	English DP12, Z=108 Metric M=2, Z=114
4	Minimum workpiece thickness	0.40mm
5	Number of planetary wheels per disc	5
6	Number of grinding workpieces per disc	(1)Φ50mm, 40 pieces (2)Φ75mm, 25 pieces (3)Φ100mm, 10 pieces
7	Grinding disc speed	0~56rpm
8	Power supply	AC380V, 50Hz
9	Air source	0.5~0.6Mpa
10	Dimensions	1650mm×1150mm×2530mm