Application:
Silicon carbide etching
Surface cleaning after etching
DESCUM
Hard mask layer, dry removal
Silicon oxide or silicon nitride etching
Removal of optical resistance between media
Surface residue removal
|
PLASMA source |
RF |
|
|
Power |
ICP |
_ |
|
BIAS |
1000W(option) |
|
|
Applicable scope |
4~8 inch |
|
|
Single processing slice count |
1 |
|
|
Appearance dimensions |
850mmx900mmx1850mm |
|
|
System control |
PLC |
|
|
Automation level |
Manual |
|
Contact: Minder Hu
Phone: 0086-15813334038
Tel: 020-84789496
Email: md@minder-hightech.com
Add: 813,No.43,Xinshuikeng Section, Shixin Road, Dalong street,Panyu District,Guangzhou. Zip:511442
