Semiconductor industry

MD-DDM08 die demounter

MD-DDM08
Product description: MD-DDM08 die demounter
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Product features：

1. Suitable for wafer peeling process of 8 inches and below;

2. Adopting non-contact film stripping to prevent damage to grains and improve product qualification rate;

3. Simple and convenient operation methods greatly improve work efficiency;

4. By using the guide rail type translational peeling method, the grains are not easily jumping during the peeling process, and the minimum grain size that can be peeled is 0.28mm * 0.28mm; This item

The peeling machine is more suitable for QFN devices;

5. Use motor rotation to control the stripping speed;

6. It is possible to easily and quickly arrange and orderly peel off grains from the mucosa, with 1-2 chips peeled per minute;

7. Optional ion air bars can help eliminate static electricity generated during film application, reducing damage to the chip (ion air bars are not included in the equipment quotation)

Within the enclosure;

8. The electrical part adopts well-known foreign brands such as SMC and Omron;

Technical specifications

No.	Content	Parameters
1	Equipment model	MD-DDM08
2	Overall dimensions	1010610379
3	Rated voltage	AC 220V
4	Frequency	（single-phase）50HZ
5	Power	≤600W
6	Overall weight	35kg
7	Adhesive film type	White membrane or black membrane
8	Adhesive film thickness	0.05mm～0.2mm
9	Stripping method	Semi-automatic