6inch Dicing saw for semiconductor industry

MDHYDS6L

MDHYDS6M

MDHYDS6H

Multi plate dicing

√

√

√

Auto focus

√

√

√

Auto align

*

*

√

Shape recognition

-

-

*

Dicing mark check

-

*

*

Non contact height test

-

*

√

Blade broken check

-

*

*

Dual camera align system

-

*

√

MDHYDS6L

MDHYDS6M

MDHYDS6H

Spec

dicing size

mm

ф6”〡□150

ф6”〡□150

ф6”〡□150

dicing depth

mm

≤4mm or custom

≤4mm or custom

≤4mm or custom

Main spindle

rotaty speed

minˉ¹

3000∽40000

10000∽50000

10000∽50000

power

kW

AC,1.25at40000minˉ¹

AC,1.5at50000minˉ¹

DC,1.5at50000minˉ¹

X axis

stroke

mm

250

250

250

speed range

mm/s

0.1∽400

0.1∽400

0.1∽500

Y axis

stroke

mm

170

170

170

resolution

mm

0.0001

0.0001

0.0001

single move accuracy

mm

≤0.003/5

≤0.003/5

≤0.002/5

F accuracy

mm

≤0.005/170

≤0.005/170

≤0.004/170

Z axis

stroke

mm

30

30

30

max blade size:

mm

ф58

ф58

ф58

resolution

mm

0.0001

0.0001

0.0001

accuracy

mm

0.001

0.001

0.001

R axis

rotary range

deg

380

380

380

Basic required

power

KVA

3.0（single phase，AC220V）

3.0（single phase，AC220V）

3.0（single phase，AC220V）

air

Mpa L/min

0.5∽0.6max consumption180

0.5∽0.6max consumption200

0.5∽0.6max consumption200

cutting fluid

Mpa L/min

0.2∽0.3max consumption3.0

0.2∽0.3max consumption3.5

0.2∽0.3max consumption3.5

cooling water

Mpa L/min

0.2∽0.3max consumption1.5

0.2∽0.3max consumption1.5

0.2∽0.3max consumption1.5

exhaust

m³/min

1.5

1.5

1.5

size

mm

580*910*1650

580*910*1650

580*910*1650

weight

kg

500

500

500