IC/TO Package line

MDZW-DJTP2032 Automatic dispensing die attach machine

MDZW-DJTP2032
Product description: die attach
INQUIRY

dispensing die attach for HIC MCM Microwave Optoelectronics

1. Using graphical operation programming to effectively improve programming

efficiency and reduce personnel requirements.

2. In low pressure mode, contact height detection is fast and accurate, effectively

controlling the consistency of adhesive thickness.

3. It can be connected to the automatic SMT machine, operate independently,

and share parameters, coordinates, and recognition height.

4. Main light+7 circular lights, effectively dealing with different interfaces.

5. Can call different chip shape subroutines.

6. The coexistence of low pressure contact height measurement and non-contact image focusing height measurement.

Model	MDZW-DJTP2032
Dispensing part
XYZ axis	stroke 200mm * 320mm * 50mm
Platform repeated positioning accuracy	soil 2um@3s
Equipment comprehensive positioning accuracy	soil 3um@3s Soil 0.1@3s (Standard Plate Test)
Chip size	5~1500g, 0.1g resolution, real-time full closure control
Chip thickness	0.076-1mm (3-40mil, standard) thinnest to 0.05mm (2mil, optional)
Glue dispensing mode	air pressure dispensing, dipping, spraying, etc
Electric injection frequency	120 times/second
Optical system	Main camera 4.2mm * 3.5mm field of view range
Glue packaging	compatible with 3CC/5CC/10CC
Material system	optional track or workbench mode
External dimensions of individual automatic SMT machine	840 * 1220 * 2000mm (excluding connecting device)
Weight	700KG
Power supply	AC220V earth 10%, 50-60HZ, 10A
Compressed air	>=0.5MPa, flow rate>50LPM,
Purification gas source vacuum pipeline pressure	<-85Kpa, pumping speed>50LPM
stability	Linear motor platform, fast and stable; Real time data recording, traceable;
Accuracy	Comprehensive positioning accuracy soil 3um@3s ; Multi point positioning to cope with shell deformation; Chinese cultural interface, what is seen and what is gained;
Usability	Graphical operation, convenient and fast; Standardized programming, quickly getting started
Die attach part
XYZ axis	stroke 200mm * 320mm * 50mm
Platform repeated positioning accuracy	soil 2um@3s
Equipment comprehensive positioning accuracy	soil 3um@3s Soil 0.1@3s (Standard Plate Test)
UPH	1000-1500 (with camera calibration) 2000-2500 (without camera calibration)
Adhesive pressure	5-1500g 0.1g resolution real-time full closure control
Chip size	length * width: 0.17mm-25mm
Thickness	50um-17mm
Optical system	Main camera 4.2mm * 3.5mm field of view range Auxiliary camera 4.2mm * 3.5mm field of view
Suction nozzle	quantity of 12, supporting automatic replacement and online automatic calibration
Material system	support 24 gel boxes/waffle boxes, optional rail or workbench mode
External dimensions of individual automatic SMT machine	840 * 1220 * 2000mm (excluding connecting device)
Weight	800KG
Power supply	AC220V earth 10%, 50-60HZ, 10A
Compressed air	>=0.2MPa, flow rate>5LPM,
Purification gas source vacuum pipeline pressure	<-85Kpa, pumping speed>50LPM