| MDAX-DS360 MD-AX380 Die Sorter Technical specification | |
| Worktable (Linear Module) | Optics System |
| Worktable stroke:150x250mm(2" tray *8 pcs;can customize) | Camera |
| Resolution:1μm |
Optics Magnifier (wafer) :0.7 times to 4.5 times optional bigger one |
| Wafer Table (Linear Module) | Cycle Time 200MS/EA |
| XY stroke:8"*8"(MDAX-DS360);12"*12"（MDAX-DS380) |
Die bonding cycle is less than 250 milliseconds, production capacity is greater than 12k; |
| Resolution: 1μm | |
| Rotary wafer table:optional | Loading and unloading module |
| Manual upload and download | |
| Wafer placement accuracy | optional magazine upload and dowload |
| Adhesive die position:±25um | |
| Rotation accuracy:±3° | |
| Dispensing module | Equipment Require |
| optional stamp method for bonding usage | Voltage: AC220V/50HZ |
| Air Source:minimum6BAR | |
| Vacuum Source:700mmHG（Vacuum pump） | |
| Power Consumpion ：3000w | |
| PR System | Dimensions And Weight |
| Method:256 grey levels | Weight :1000kg |
| Detection : ink/chipping/cracked die | Size(DxWxH)外型尺寸 1300*1400*1700mm |
| Monitor :17"LCD | Missing Die :yes |
| Monitor Resolution:1024*768 | Vacuum Sensor |
Contact: Minder Hu
Phone: 0086-15813334038
Tel: 020-84789496
Email: md@minder-hightech.com
Add: 813,No.43,Xinshuikeng Section, Shixin Road, Dalong street,Panyu District,Guangzhou. Zip:511442
