Laser Solutions

MDSL-LD3030 Laser Decapsulation machine

MDSL-LD3030
Product description: Laser Decapsulation
INQUIRY

1.Application Areas

laser decapsulation system designed for precise and efficient removal of epoxy and plastic molding materials.

2.Laser Processing Principles

Laser processing technology focuses light energy through a lens to form a high-energy-density laser beam. Leveraging the interaction between the laser beam and matter, it performs cutting, engraving, welding, surface treatment, drilling, cleaning, and micromachining on materials (including metals and non-metals).

As an advanced manufacturing technology, laser processing has been widely applied in key sectors of the national economy, including automotive, electronics, electrical appliances, aviation, metallurgy, and machinery manufacturing. It plays an increasingly important role in improving product quality, increasing productivity, facilitating automation, and reducing pollution and material consumption. Across various fields, laser cutting, laser marking, and laser welding are the most widely used.

The laser decapsulation machine easily and conveniently removes the encapsulation layer from plastic-encapsulated semiconductor devices, exposing the lead frame on the substrate.

It features a fully graphical user interface for simple control.

It can easily handle full-surface, targeted, or even flat decapsulation of plastic encapsulation material, significantly reducing the amount of acid used and the time required for chemical decapsulation, while maximizing the success rate of decapsulation.

It is capable of decapsulating a variety of plastic-encapsulated devices, including integrated circuits and discrete components.

It also offers excellent decapsulation performance for gold, copper, aluminum, and silver wire encapsulation.

sample:

Performance parameters

Number of laser heads/laser wavelength	MOPA30W*1 set, 1064nm
Optical configuration Parameter range	Laser head focal length 160mm/110mm x 110mm Minimum opening area 0.1mm x 0.1mm Maximum opening area 300mm x 300mm
Laser cooling method	Air cooling
Opening depth	0.01mm-10mm
Opening depth setting resolution	0.001mm; manually set target opening depth
Galvanometer scanning speed	>8000mm/s
Product movement method	Two-position electric worktable (electronic handwheel control/software-automated)
Positioning/error-proofing method	Visual recognition-assisted positioning + negative pressure/clamping fixture
Software	MD laser-specific opening vision software; manually set opening depth
Product cleaning	Vacuum suction dust removal
Vision inspection	Real-time CCD monitoring
Other auxiliary equipment	Built-in dust collection system
System integration	MES and EAP (TCP/IP compatible; supports SECS-GEM communication standards)
Equipment dimensions	Length: 1150mm * Width: 1000mm * Height: 1750mm

Main configuration

	Components	Brief Description
1	Laser	30W, frequency-tunable laser/100,000-hour lifespan
2	Galvanometer lens	Speed: 0-8000 mm/s
3	F-θ lens	Selectable range: 70mm x 70mm, maximum: 150mm x 150mm
4	D/A controller card	16-bit high-performance D/A converter card
5	Laser power supply	Fully digital control
6	Computer	Industrial-grade, P4 2.0G, 4G, 1TB
7	Optical system	Real-time video observation system with preview, CCD > 20 megapixels
8	Automatic sample stage	Automatic stepping XY sample stage, 300 x 300mm travel (accuracy: 0.02mm)
9	Fume and dust removal	Minimum level 2 filtration, 0.3µ particle filtration efficiency ≥ 98%
10	Laser safety glass window	Glass observation window effectively prevents laser damage
11	Control unit (MMI) software	Windows-compatible de-cap software