IC/TO Package line

  • MDSJSQW-3045 automatic big area deep access wedge bonder
  • MDSJSQW-3045 automatic big area deep access wedge bonder
MDSJSQW-3045 automatic big area deep access wedge bonderMDSJSQW-3045 automatic big area deep access wedge bonder

MDSJSQW-3045 automatic big area deep access wedge bonder

  • MDSJSQW-3045
  • Product description: deep access wedge bonder
  • INQUIRY

Equipment parameters

■ scope of application: discrete devices, microwave components, lasers, optical communication devices, sensors, MEMS, sound meter devices, RF modules, power devices, etc

■ type of welding wire: gold wire (12.5um-75um)

■ arc length and arc height of welding line: fully programmable

■ welding wire accuracy: ± 3um, @ 3sigma

■ ultrasonic: 0 ~ 5W control accuracy, step flexible application ability

■ pressure: 0-200g, mechanical resolution 0.1g, force control repeatability < 1g

■ suitable cleaver length: 16mm, 19mm

■ welding area: large area: 330mmx432mm, ± 220 ° rotation range

■ welding wire speed: 3 ~ 7wire / S (@ 25um gold wire & 1mm wire length)

■ operating system: Windows

■ net weight of equipment: 1350kg

 

Key features

Real time deformation monitoring;

Real time ultrasonic energy monitoring;

Fixed length and fixed height arc control capability;

Tail wire control mechanism of piezoelectric ultrasonic motor;

Deep cavity bonding capacity of 16mm and 19mm cleaver length;

HD bonding head maintenance image auxiliary tool;

Large welding area.

CATEGORIES

CONTACT US

Contact: Minder Hu

Phone: 0086-15813334038

Tel: 020-84789496

Email: md@minder-hightech.com

Add: 813,No.43,Xinshuikeng Section, Shixin Road, Dalong street,Panyu District,Guangzhou. Zip:511442