MDSD wafer dryer

MDSD wafer dryer

Features

*Reasonable structure design and mature technology

*Simple operation, convenient maintenance, stable and reliable operation of the whole machine

*Low vibration, good reliability and large output

technical parameter

*Wafer size: applicable to 2-12-inch production line

*Fragment rate: 1/10000

application area

SPM acid cleaning, organic cleaning, development, degumming, ITO etching, BOE etching, uniform glue and other process wafer drying

Equipment function

The equipment is divided into 2 stations, 4 stations and 6 stations, which can clean 2-12-inch silicon wafers, potassium nitride, gallium arsenide, sapphire, semiconductor, LED, solar energy and other wet processes, including cleaning, drying, nitrogen drying and working chamber drying.

process parameters

Factory conditions

Features

*Adopt PLC intelligent control to make all operation reliable and program intelligent.

*Adopt frequency conversion motor belt drive, low maintenance.

*Rotary shaft nitrogen seal, labyrinth design, to ensure that the chamber is isolated from the external environment during equipment operation.

*PTFE air control valve, clean pipe fittings.

*The main components are made of high-quality stainless steel SUS304. The internal frame is made of national standard stainless steel square steel, which is corrosion resistant and corrosion resistant. The appearance design is novel, humanized and easy to operate.

*The rotating mechanism is verified by precise dynamic balance, and the main frame is of load-bearing structure, which ensures the balance and stability of the system during operation, reduces the generation of vibration sources and greatly reduces the fragmentation rate.

*The top of the cover adopts imported silica gel heating auxiliary system, which is dry without dripping after drying.

*Electric heating system is adopted, with fast temperature rise, easy control and stable temperature.