IC/TO Package line

Film to Film Die Sorter MDAX-DS380F

1， Support 12-8 inch wafer input and 12-8 inch wafter output. (support customize wafer sizes)

2， Support multiple die sizes(0.3-25mm). need conversion kits)

3， With strong mapping function. As well as BIN functions.

4， With Missing die function.

5， With wafer expanding function.

6， With vacuum pick up.

7， With dual arm system and middle second correction function.

8， Independent software ability.

MDAX-DS380F Film to Film Die Sorter
Worktable (Linear Module)	Optics System
340mm*340mm(12inch max)	Camera
Resolution:0.5μm	Optics Magnifier (wafer) :0.7 times to 4.5 times optional bigger one
Wafer Table (Linear Module)	Cycle Time 200MS/EA
12"max	Die bonding cycle is less than 250 milliseconds, production capacity is greater than 12k;
Resolution: 1μm
Rotary wafer table: optional	Loading and unloading module
	Manual upload and download
Wafer placement accuracy	optional magazine upload and dowload
Adhesive die position:±25um
Rotation accuracy:±0.5°

Dispensing module	Equipment Require
optional stamp method for bonding usage	Voltage: AC220V/50HZ
Die pressure:40-250g	Air Source:minimum6BAR
Arm rotary :180degree	Vacuum Source:700mmHG（Vacuum pump）
	Power Consumpion ：3000w
PR System	Dimensions And Weight
Method:256 grey levels	Weight :1000kg
Detection : ink/chipping/cracked die	Size(DxWxH) 170014001700mm
Monitor :17"LCD	Missing Die :yes
Monitor Resolution:1024*768	Vacuum Sensor