IC/TO Package line

MDZWSQB-1522 Auto deep access Wire Ball Bonder

Features

1. Constant Loop Height, Constant LoopLength,Increase the Looping Consistency.

2. Continuous real time monitoring and controlling of wire deformation

3. Optimized PR especially on LTCC/HTCC

4.Bump/BSOB/BBOS.

Product advantages

Adaptability	1-High efficient transducer，more reliable quality ofbond；
	2-Table tear and Clamp tear；
	3-Sectionalized bonding parameter, for the different interface；
	4-Multi sub-program to be combined；
	5-SECS/GEM protocol；
Stability	6-Real time detection of wire deformation；
	7-Real time detection of ultrasonic power；
	8-Second display screen；
Consistency	9-Constant loop height,loop length；
Consistency	10-online BTO for wedge tool calibration by uplook video.

Parametric Metrics

Bonding Area	XY：150120mm（Inline）150*225mm（Fixed workholder）Z：50mm
Theta rotation	-360°~360°
Placement precision	±3um@3S ±0.00018°@3S
Bond force	1-300g precision0.1g programmable
Wire	Au wire:12-75um，Al wire:20- 100um
Ribbon	Au ribbon 2512.7μm-25025.4μm
Deep Access	Compatible 16/19mm capillary
EFO	0~100mA，0~4000us programmable multi-Profile mode
UPH	2~7 wire per second