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  • MDSJSQW-3045 automatic big area deep access wedge bonder
  • MDSJSQW-3045 automatic big area deep access wedge bonder
MDSJSQW-3045 automatic big area deep access wedge bonderMDSJSQW-3045 automatic big area deep access wedge bonder

MDSJSQW-3045 automatic big area deep access wedge bonder

  • MDSJSQW-3045
  • 产品描述:deep access wedge bonder
  • 在线订购

Equipment parameters

■ scope of application: discrete devices, microwave components, lasers, optical communication devices, sensors, MEMS, sound meter devices, RF modules, power devices, etc

■ type of welding wire: gold wire (12.5um-75um)

■ arc length and arc height of welding line: fully programmable

■ welding wire accuracy: ± 3um, @ 3sigma

■ ultrasonic: 0 ~ 5W control accuracy, step flexible application ability

■ pressure: 0-200g, mechanical resolution 0.1g, force control repeatability < 1g

■ suitable cleaver length: 16mm, 19mm

■ welding area: large area: 330mmx432mm, ± 220 ° rotation range

■ welding wire speed: 3 ~ 7wire / S (@ 25um gold wire & 1mm wire length)

■ operating system: Windows

■ net weight of equipment: 1350kg

 

Key features

Real time deformation monitoring;

Real time ultrasonic energy monitoring;

Fixed length and fixed height arc control capability;

Tail wire control mechanism of piezoelectric ultrasonic motor;

Deep cavity bonding capacity of 16mm and 19mm cleaver length;

HD bonding head maintenance image auxiliary tool;

Large welding area.

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CONTACT US

联系人:胡顺语

手机:0086-15813334038

电话:020-84789496

邮箱:md@minder-hightech.com

地址: 广州市番禺区大龙街市新路新水坑段43号813