IC/TO Package line

  • MDSJSQB-3045 Full-automatic deep access big area ball bonding machine
  • MDSJSQB-3045 Full-automatic deep access big area ball bonding machine
MDSJSQB-3045 Full-automatic deep access big area ball bonding machineMDSJSQB-3045 Full-automatic deep access big area ball bonding machine

MDSJSQB-3045 Full-automatic deep access big area ball bonding machine

MDSJSQB-3045 Full-automatic deep access big area ball bonding machine

Real-time deformation monitoring

Real-time ultrasonic energy monitoring

Arc control capability of fixed length and height

Piezoelectric ultrasonic motor tail wire control mechanism

Deep cavity bonding capacity of 16mm and 19mm cleat length

HD bonding head maintenance image assistant tool

Large area of coal connection area

Scope of application

Discrete devices, microwave components, lasers, optical communication devices, sensors, MEMS, sound meter devices, RF modules, power devices, etc

Welding accuracy

±3um

Welding line area

305mm in X direction, 457mm in Y direction, 0~180 ° rotation range

Ultrasonic range

0~4W control accuracy, ladder flexible application capability

Arc control

Fully programmable

Cavity depth range

Maximum 12mm

Bonding force

0~220g

Cleave length

16mm、19mm

Type of welding wire

Gold thread (18um~75um)

Welding line speed

≥4wires/s

operating system

Windows

Net weight of equipment

1.2T

Installation requirements

input voltage

220V士10%@50/60Hz

Rated power

2KW

Compressed air requirements

≥0.35MPa

area covered

Width 850mm * depth 1450mm *height 1650mm

导航栏目

联系我们

CONTACT US

联系人:胡顺语

手机:0086-15813334038

电话:020-84789496

邮箱:md@minder-hightech.com

地址: 广州市番禺区大龙街市新路新水坑段43号813