MDHWS300 NDT Ultrasonic inspection system

High-speed ultrasonic scanning microscope-ultrasonic nondestructive testing equipment.

This model has a scanning speed of 1000mm/s and a scanning acceleration of 8m/s². The scanning efficiency of typical application scenarios reaches 35 seconds per piece, which is suitable for high-speed full inspection of precision devices such as semiconductors, integrated circuits and diamonds, and provides high-performance solutions. The overall welding frame and active balance vibration reduction mechanism are adopted to effectively reduce the shaking of the body caused by high acceleration and improve the imaging quality.

Maximum scanning speed 1～4000UM

Recommended resolution for images  1000MM/S

Equipment introduction

MDHWS300 is designed and developed for the specific needs of internal inspection of materials, and realizes non-destructive inspection of internal defects of materials and welding quality. According to the principle of ultrasonic non-destructive testing, the inspection of welding quality includes the following four steps, as shown in the figure.

(a)Schematic diagram of ultrasonic inspection welding surface

(b) A-scan waveform of reflected echo

(c) C-scan image obtained by full scan

(1) The ultrasonic probe generates ultrasonic pulses, which reach the measured workpiece through the coupling medium (water);

(2) When the ultrasonic pulse passes through the measured workpiece, reflection and transmission occur at various interfaces, such as the inside of the workpiece, the upper surface, the welding surface, the lower surface of the workpiece, etc., forming reflected echoes and transmitted waves;

(3) The ultrasonic probe receives the reflected echo and converts it into an electrical signal;

(4) The computer system accurately identifies and extracts the reflected echo signal of the welding surface, displays the waveform through signal processing, and then obtains the defect image of the designated area by scanning, and draws the detection conclusion based on the image.

Equipment advantage

High-performance all-in-one machine - 1000mm/s scanning speed, 8m/s² scanning acceleration. The scanning efficiency of typical application scenarios reaches 35 seconds per piece, which is X times that of the S100 model. It provides a high-performance solution for fast full inspection of large quantities of small and medium-sized workpieces. The overall welding frame and active balance vibration reduction mechanism are adopted to effectively reduce the shaking of the body caused by high acceleration and improve the imaging quality.

1. The performance is more stable and durable

MDHWS300 has better stability in use, and has higher quality in terms of product failure rate and product detection accuracy. Comprehensive testing of various components, stable performance can make the testing process more efficient and the detected results more accurate.

2. The imaging effect is better

MD-S300 can not only perform microscopic inspection of the product, but also simulate the inspection image through the sensor for the operator to analyze. Usually, the high-quality ultrasonic inspection equipment makes the image clearer and the display screen more refined, which can provide the operator with a more intuitive inspection image. , can play a very important role in product detection failure analysis.

3. Maintenance is less difficult

Under the premise of non-damage, the ultrasonic detector hardly needs special maintenance. It only needs to clean the dust properly. Even in the future maintenance, it is extremely simple. The various detachable structures reduce the amount of engineering and the difficulty of maintenance. It can be maintained by itself, and it can also reduce the overall cost of maintenance, so this model is humanized and high-end.

4. Long service life

What is the difference between ultrasonic scanning microscope and nondestructive testing? The biggest difference is that the former has longer service life and higher resolution. Because it uses high-quality accessories and materials, it can better ensure its durability

Technical Parameter

Application field

1. Semiconductor chip package layer detection